Global Solder Materials Market is valued at approximately USD XX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX% over the forecast period 2022-2028. Solder is a fusible metal alloy that is generally used to form a bond between metal workpieces. The filler metal used during the process consists of a lower melting point compared to the other adjoining metal. Factors such as the rising usage in the automotive industry, growing demand from the electronics industry, coupled with the increasing R&D investments for lead-free solder materials are propelling the market demand across the globe. For instance, according to Statista, in 2017, the automotive industry was estimated to be worth around USD 5,315 billion, and the industry progressively grows and is anticipated to reach USD 8,931 billion by the year 2030. Consequentially, the growth of the automotive industry is stimulating the demand for Solder Materials, which, in turn, excels the global market growth in the near future. However, the high cost of lead-free solder and several health risks associated with soldering impede the growth of the market over the forecast period of 2022-2028. Also, the rising emergence of nanoparticle-based solder materials and the growing adoption of solder materials from the semiconductor industry are anticipated to act as catalyzing factors for the market demand during the forecast period.

The key regions considered for the global Solder Materials Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America is the leading region across the world in terms of market share owing to the increasing production of advanced semiconductor devices and growth of the refurbishing industry. Whereas, Asia-Pacific is anticipated to exhibit the highest CAGR over the forecast period 2022-2028. Factors such as the surging demand for electronic devices, as well as rising government initiatives toward economic development, would create lucrative growth prospects for the Solder Materials Market across the Asia-Pacific region.

Major market players included in this report are:

Element Solutions, Inc.

Lucas Milhaupt Inc.

Henkel AG & Co. KGaA

Senju Metal Industries Co. Ltd.

Koki Company Limited

Indium Corporation

The Dow Chemical Company (DowDuPont)

Tamura Corporation

Stannol GmbH & Co. KG

Nihon Genma

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Product Type:

Solder Wire

Solder Paste

Solder Bar

Solder Flux

By Process:

Screen-printing

Robotic

Laser

Wave/Reflow

By Region:

North America

U.S.

Canada

Europe

UK

Germany

France

Spain

Italy

ROE

Asia Pacific

China

India

Japan

Australia

South Korea

RoAPAC

Latin America

Brazil

Mexico

Rest of the World

Furthermore, years considered for the study are as follows:

Historical year - 2018, 2019, 2020

Base year - 2021

Forecast period - 2022 to 2028

Target Audience of the Global Solder Materials Market in Market Study:

Key Consulting Companies & Advisors

Large, medium-sized, and small enterprises

Venture capitalists

Value-Added Resellers (VARs)

Third-party knowledge providers

Investment bankers

Investors