Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2027 (USD Million)
1.2.1. Wafer Backgrinding Tape Market, by Region, 2019-2027 (USD Million)
1.2.2. Wafer Backgrinding Tape Market, by Type, 2019-2027 (USD Million)
1.2.3. Wafer Backgrinding Tape Market, by Wafer Size, 2019-2027 (USD Million)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Wafer Backgrinding Tape Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Wafer Backgrinding Tape Market Dynamics
3.1. Wafer Backgrinding Tape Market Impact Analysis (2019-2027)
3.1.1. Market Drivers
3.1.1.1. Increasing demand from wafer fabrication
3.1.1.2. Growing semiconductor industry
3.1.2. Market Challenges
3.1.2.1. High cost of wafer backgrinding tape
3.1.3. Market Opportunities
3.1.3.1. Advancement in wafer backgrinding tapes by market players
Chapter 4. Global Wafer Backgrinding Tape Market Industry Analysis
4.1. Porter's 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter's 5 Force Model (2018-2027)
4.2. PEST Analysis
4.2.1. Political
4.2.2. Economical
4.2.3. Social
4.2.4. Technological
4.3. Investment Adoption Model
4.4. Analyst Recommendation & Conclusion
4.5. Top investment opportunity
4.6. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
5.1.1. Assessment of the overall impact of COVID-19 on the industry
5.1.2. Pre COVID-19 and post COVID-19 market scenario
Chapter 6. Global Wafer Backgrinding Tape Market, by Type
6.1. Market Snapshot
6.2. Global Wafer Backgrinding Tape Market by Type, Performance - Potential Analysis
6.3. Global Wafer Backgrinding Tape Market Estimates & Forecasts by Type 2018-2027 (USD Million)
6.4. Wafer Backgrinding Tape Market, Sub Segment Analysis
6.4.1. UV Curable
6.4.2. Non-UV
Chapter 7. Global Wafer Backgrinding Tape Market, by Wafer Size
7.1. Market Snapshot
7.2. Global Wafer Backgrinding Tape Market by Wafer Size, Performance - Potential Analysis
7.3. Global Wafer Backgrinding Tape Market Estimates & Forecasts by Wafer Size 2018-2027 (USD Million)
7.4. Wafer Backgrinding Tape Market, Sub Segment Analysis
7.4.1. 6-Inch
7.4.2. 8-Inch
7.4.3. 12-Inch
7.4.4. Others
Chapter 8. Global Wafer Backgrinding Tape Market, Regional Analysis
8.1. Wafer Backgrinding Tape Market, Regional Market Snapshot
8.2. North America Wafer Backgrinding Tape Market
8.2.1. U.S. Wafer Backgrinding Tape Market
8.2.1.1. Type breakdown estimates & forecasts, 2018-2027
8.2.1.2. Wafer Size breakdown estimates & forecasts, 2018-2027
8.2.2. Canada Wafer Backgrinding Tape Market
8.3. Europe Wafer Backgrinding Tape Market Snapshot
8.3.1. U.K. Wafer Backgrinding Tape Market
8.3.2. Germany Wafer Backgrinding Tape Market
8.3.3. France Wafer Backgrinding Tape Market
8.3.4. Spain Wafer Backgrinding Tape Market
8.3.5. Italy Wafer Backgrinding Tape Market
8.3.6. Rest of Europe Wafer Backgrinding Tape Market
8.4. Asia-Pacific Wafer Backgrinding Tape Market Snapshot
8.4.1. China Wafer Backgrinding Tape Market
8.4.2. India Wafer Backgrinding Tape Market
8.4.3. Japan Wafer Backgrinding Tape Market
8.4.4. Australia Wafer Backgrinding Tape Market
8.4.5. South Korea Wafer Backgrinding Tape Market
8.4.6. Rest of Asia Pacific Wafer Backgrinding Tape Market
8.5. Latin America Wafer Backgrinding Tape Market Snapshot
8.5.1. Brazil Wafer Backgrinding Tape Market
8.5.2. Mexico Wafer Backgrinding Tape Market
8.6. Rest of The World Wafer Backgrinding Tape Market
Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. AI Technology Inc.
9.2.1.1. Key Information
9.2.1.2. Overview
9.2.1.3. Financial (Subject to Data Availability)
9.2.1.4. Product Summary
9.2.1.5. Recent Developments
9.2.2. AMC Co. Ltd.
9.2.3. Denka Company Limited
9.2.4. Furukawa Electric Co. Ltd.
9.2.5. Force-One Applied Materials
9.2.6. Lintec of America Inc. (Lintec Corporation)
9.2.7. Mitsui Chemicals Inc.
9.2.8. Nitto Denko Corporation
9.2.9. Pantech Tape Co. Ltd.
9.2.10. Minitron Elektronik GmbH
Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption